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111Category: | Adhesives and Sealants/Epoxy Adhesives |
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CAS NO: | 25550-51-0 | ||
EC NO: | 247-094-1 | ||
Molecular Formula: | C18H26O7 | ||
Molecular Weight: | 354.3948 | ||
Specification: | light yellow transparent liquid | ||
InChI: | InChI=1/C18H26O7/c1-17(9-5-3-7-11(17)13(19)20)15(23)25-16(24)18(2)10-6-4-8-12(18)14(21)22/h11-12H,3-10H2,1-2H3,(H,19,20)(H,21,22) | ||
Packing: | 20 kilograms, 25 kg, 220 kg and 240 kg IBC barrel packaging | ||
Product description: Colorless transparent liquid, basically does not change color after adding accelerator, epoxy curing material white color; The complex composed of aliphatic epoxy resin has low viscosity, long application period, good heat resistance and high temperature electrical properties. There is no double bond in the molecular structure, and the cured epoxy resin has good weatherability and aging resistance without being affected by light and heat. The molecular structure is relatively non-polar, curing material has good moisture resistance; High reactivity, quick curing, short gel time, high thermal deformation temperature of the cured material. |
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Uses: | 1. Epoxide curing agent: it can be used for impregnation of electrical equipment coils and casting of electrical components and sealing ofsemiconductors, such as casting outdoor insulators, light-emitting diodes(LED), ignition coils, capacitors for spec | ||
Synonyms: | methyl hexahydrophthalic anhydride (MHHPA);methyl hexahydrophthalic anhydride;3,4-Methyl hexahydrophthalic anhydride;MeHHPA;3a-methylhexahydro-2-benzofuran-1,3-dione;2,2'-(oxydicarbonyl)bis(2-methylcyclohexanecarboxylic acid);MHHPA;Hexahydromethylphthalic anhydride; | ||
Molecular Structure: |