POONGSAN MIROTEC CORP.
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LEADFRAME
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The key component of semiconductors.
CONNECTOR
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High-performance fine pitch connectors and related parts.
TOOLING
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Progressive stamping die made of precisely processed tungsten carbide.
PRE-MOLDED PRODUCTS
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Hollow structure package with leadframe and mold-formation technology.
Pd
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CAS NO:88-96-0; MF:C
8
H
8
N
2
O
2
Developed to eliminate the environmental pollutant Pb.
HIGH-PRECISION CONTACT
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Developed based on the key technologies of high-precision press processing and precious metal plating.
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