Jiande City Silibase Silicone New Material Manufacturer Co., Ltd

Silicone Adhesive for Electronics

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  Catalyst and Auxiliary

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  Product Name: Silicone Adhesive for Electronics Item No.: SilibaseSR-6169 Distinguishing Feature of SilibaseSR-6169 Silicone Adhesive for Electronics: SilibaseSR-6169 Silicone Adhesive for Electronics is a toluene solution based on polysiloxane raw rubber and resin, and then added with additives. It is a kind of high temperature resistant pressure sensitive adhesive. It can be mixed with other methylsiloxane pressure sensitive adhesives to achieve specific properties. It can be used over a wide temperature range and can bond a variety of low surface energy, difficult-to-bond materials such as silicones, fluoropolymers, polyolefins, and more. Standards of SilibaseSR-6169 Silicone Adhesive for Electronics: Model SilibaseSR-6169 Physical and chemical indicators Exterior Colorless transparent viscous liquid Solid content（150℃*2h），% 58-60 Viscosity（25℃），CP 3-12W PH value 7 Proportion（25℃） 0.98 Bonding properties after vulcanization Initial sticky（Steel ball，∠30） 19-24 Peel strength PET Transparent film(g/25um) ≧1000 Add color paste 1%(g/25um) ≧950 Sticky (230℃*3h) No displacement Temperature resistance(230℃*30min) Hot peeling Note: Proportion of rubber, according to the original glue: thinner: BPO = 100:65:1.5-2.0 ratio, after 90℃*2min solvent removal, 160℃*6min curing; test conditions: temperature 25℃, humidity 55- 65%, PET film thickness is 38um, dry glue thickness is 22-25um. Scope of Application: As a pressure-sensitive adhesive, it can be applied to PET, aluminum foil and other substrates by traditional high-temperature tape coating equipment to produce pressure-sensitive adhesive tape with special properties. It has good high temperature resistance and chemical resistance, and can also be applied to printing. Circuit board plating process masking, SMT process, FPC, PCB board, sand blasting, painting, high temperature baking varnish, gold plating or plating process, shielding parts, and electronic and electrical products, such as insulation and wrapping. Construction Instructions: ● The adhesive can be directly coated with a traditional tape coating device. Before the coating, it can be further diluted with a solvent such as toluene or xylene. The concentration of the working solution is preferably about 35%, depending on the respective Equipment and experience to determine. The solvent must be well ventilated when applying the solvent, and please observe the solvent supplier's safety precautions and related regulations. ● In some applications, due to insufficient bonding of the adhesive to the backing material, it may be necessary to apply a primer before applying the adhesive. The primer material must be cured prior to use. The curing conditions depend on the performance of the equipment, the type of substrate, and the formulation used. ● Surface vulcanization cycle: 80-90℃*2 min solvent removal to ensure that no solvent is present in the adhesive when it enters the curing zone; 160-170℃*6 min, through thermal curing to make its adhesion, cohesive strength and The initial adhesion is further strengthened. However, the exact conditions required for complete vulcanization depend on the length, temperature and efficiency of the furnace, the type of curing agent, and the type of substrate used, and must be tested on the equipment to determine this condition. Packaging and Storage: Put it into a clean and dry 200kg iron drum and seal it with a lid. Store at room temperature (0 ~ 35℃), storage period is 6 months (qualified inspection, still available) to prevent direct sunlight, storage and transport according to flammable products.