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Plasma etching
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Post Date: | Dec 04,2009 |
Expiry Date: | Dec 04,2010 |
Detailed Description: | Cas No. : Plasma etching Modern VLSI processes avoid wet etching, and use plasma etching instead. Plasma etchers can operate in several modes by adjusting the parameters of the plasma. Ordinary plasma etching operates between 0.1 and 5 torr. (This unit of pressure, commonly used in vacuum engineering, equals approximately 133.3 pascals.) The plasma produces energetic free radicals, neutrally charged, that react at the surface of the wafer. Since neutral particles attack the wafer from all angles, this process is isotropic. The source gas for the plasma usually contains small molecules rich in chlorine or fluorine. For instance, carbon tetrachloride (CCl4) etches silicon and aluminium, and trifluoromethane etches silicon dioxide and silicon nitride. A plasma containing oxygen is used to oxidize ("ash") photoresist and facilitate its removal. Ion milling, or sputter etching, uses lower pressures, often as low as 10-4 torr (10 mPa). It bombards the wafer with energetic ions of noble gases, often Ar+, which knock atoms from the substrate by transferring momentum. Because the etching is performed by ions, which approach the wafer approximately from one direction, this process is highly anisotropic. On the other hand, it tends to display poor selectivity. Reactive-ion etching (RIE) operates under conditions intermediate between sputter and plasma etching (between 10-3 and 10-1 torr). Deep reactive-ion etching (DRIE) modifies the RIE technique to produce deep, narrow features. Common etch processes used in microfabrication Seeking coorparation with overseas semiconductor equipments manufacturers Our company is one professional manufacturer of semiconductor equipment in China, now we are searching for overseas excellent semiconductor equipment manufacturers,material enteprise and equipment parts manufacturers to cooperate.With the world ecnomic globalizing,it is not impossible for one company to monopolize highest technology and market in any field in any country, increasing global collaboration is the gold key to developing technology and expanding world market,seeking overseas topping partners to achieve win-win cooperation is one strategic plan of our company now and will continue.List company’s brief introduction,cooperation fields,cooperation modes,cooperation advantages and benefits as follows: Brief introduction: Suzhou CSE Semiconductor Equipment Technology Co., Ltd., is a joint- stock enterprise invested by CAS Suzhou Institute of Nano-tech and Nano-bionics and Beijing HL Co., our major products are semiconductor equipments, solar photovoltaic equipments, LCD cleaning facilities, vacuum equipments and etc.; Depending on the high-tech R&D team of CAS Suzhou Institute of Nano-tech and Nano-bionics and HL’s skillful experience in related industries together, we occupied the middle market of semiconductor equipment rapidly and have owned steady and loyal customer groups. In inner semiconductor equipments field, we cooperated with country research institutes and entered 8” wafer market firstly as one of the earliest and largest manufaturers. Cooperation fields: Semiconductor equipments and parts manufacturer; Solar photovoltaic equipments and parts manufacturer; LCD cleaning facilities and parts manufacturer; Semiconductor material enteprise; Others related companies; Cooperation modes: Technology cooperation; OEM; Providing sales and after sales sevice; Agency; Cooperation advantages: Professional skills in technology,producing and after sales; Professional sales experiences and steady customer groups; Topping professors of Suzhou Nano- tech institute as our partner; Vigorous support from Suzhou government; Advantaged geographical position; Cooperation benefits: Provide excellent and high cost performance products and service; Assist foreign companies entering China market; |
Company: | Suzhou CSE Semiconductor Equipment Technology Co., Ltd. |
Contact: | Amy Chang |
Tel: | +86-18913168552 |
Fax: | +86-18913168552 |
Email: | Send Message |
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