Copper powder
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Post Date: | Sep 08,2013 |
Expiry Date: | Sep 08,2014 |
Detailed Description: |
Cas No. :7440-50-8
Payment Method: by T/T or L/C Copper powder Copper powder contain electrolytic copper powder,atomized copper powder,ultra fine copper powder,copper alloy powder bronze powder,brass powder and so on. APPLICATION Widely used in diamond tools, carbon brushes, friction materials, P/M products and abrasive materials,pastes, electrical and electronic applications. PHYSICAL PROPERTIES PROPERTY STANDARD SPECIFICATION OBSERVATION MIN MAX FLOW-SECS/SOGMS MPIF-03 30 35 32 APPARENT DENSITY GMS/CC MPIF-04 2.6 2.9 2.84 SIEVE ANALYSIS MESH (%) MICRON(%) MPIF-05 +100 +150 0.3 0.0 -100 +150 -150 +106 14.0 18.0 18.0 -150 +200 -106 +75 15.0 20.0 18.0 -200 +240 -75 +63 16.0 20.0 12.0 -240 +325 -63 +45 18.0 23.0 18.0 -325 -45 30.0 42.0 34.0 CHEMICAL ANALYSIS COPPER CONTENT(%) 99.0 99.82 HYDROGEN LOSS(%) MPIF-02 0.40 0.32 ACID INSOLUBLE(%) MPIF-06 0.25 0.14 |
CAS Registry Number: | 7440-50-8 |
Synonyms: | ;C.I. 77400;C.I. Pigment Metal 2;Copper;copper coating quality balzers;Copper ingot;raney-copper ready for use;Raney-Copper;Copperpowderdendritic;CopperrodNmmdiacElectrolytic copperagcm;CoppershotNmmdia;CopperturningsN;CopperfoilNmmthickxmmwide;Copperwireclothmeshmmwidemmwiredia;Copperwiremmdia;Copperwiresreducedfromoxide;CopperpowderNmesh;Copperpowdersphericalmesh;Copperpowdermeshunderargon;CopperwireNmmdia;CopperfoilNmmthick;CoppershotNmm;Copper powder;Copper, small rods for elemental analysis;Copper (S, P);Electrolytic tough pitch copper (O);Copper (O);Continuous cast copper (O);Electrolytic copper (trace elements);Copper with added impurities (trace elements);Copper foil(99.9%);Copper wire (99.99) 0.25mm dia.;Bronze, powder;Copper wire (99.999%) 0.76mm dia.;Copper wire cloth;Copper foil (99.9985%);Copper foil(99%);Copper shot(99.9) 1-10mm;Copper shot(99.999%) 2-8mm;Copper metal foil;Copper turnings;Copper metal wire;Copper solution 1000 ppm;Copper solution 10 000 ppm;Electrolytic copper;Sponge copper;Copper nanopowder;copper(2+); |
Molecular Formula: | Cu |
Molecular Weight: | 63.5449 |
Molecular Structure: | |
Hazard Symbols: | F:Flammable; |
Risk Codes: | R11:; |
Safety Description: | S16:; |
Company: | LIZHONG INDUSTRY AND TRADE CO.,LTD [ China ] |
Contact: | angelia |
Tel: | 86-319-5231338 |
Fax: | |
Email: | angelialu05@hotmail.com |
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