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Curing agent for epoxy resins

Inquiry
  Post Date: Aug 28,2015
  Expiry Date: Sep 11,2015
  Detailed Description: Cas No. :464-58-5 Quantity: 20000Metric Tons
Specs:DICY 10, micro-dicyandiamide
Price:FOB 3200 USD Metric Tons
Payment Method: TT/LC at sight
Micro-Dicyandiamide is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clumping and improve application. Micro-dicyandiamide is designed for use as a latent agent for epoxy resins.
The fine particle size of Micro-dicyandiamide provides enhanced reactivity in epoxy resin.
Micro-dicyandiamide is easily dispersed in liquid resins.
Items Index
Appearance Free Flowing White Powder
Purity (%) 97.5 min
Free Water (%) 0.3 max
Melt Point (°C) 209-212
Particle Size (98%)[µm] 10μm max
Dispersant (%) 1.5 max
Usage:
1. Micro-dicyandiamide can be used as One Component Adhesives
2. Micro-dicyandiamide can be used as Epoxy Powder Coatings
3. Micro-dicyandiamide can be used as Prepregs and Film Adhesives
4.Micro-dicyandiamide can be used as Electronic Potting and Encapsulating Compounds
Package and Storage: Net weight 25kg, 500kg, 1000kg poly woven bag, or other package

  CAS Registry Number:

464-58-5


  Company: Ningxia Beilite Chemical Industry Co., Ltd.     [ China ]        
  Contact: Lisa Li
  Tel: 021-60560163
  Fax:
  Email: info@dicyandiamidechina.com
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