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Diamond Dicing Blades

Inquiry
  Post Date: Aug 14,2017
  Expiry Date: Aug 14,2018
  Detailed Description: Quantity: 20FCL
Payment Method: T/T, Western Union, MoneyGram, PayPal,etc
Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

The Type: diamond hub dicing blade and diamond hubless dicing blade
1.Electroformed dicing blade
The Type: diamond hub dicing blade and diamond hubless dicing blade

Electroformed dicing blade
Features: Easy to handle ultra-thin blade; Blade dicing after laser grooving; Variety of different grit concentrations; Shows stable processing 
performance in high load processing


Hub dicing blade
Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)
 


resin dicing blade
Features: High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials   

metal dicing balde
Features: High rigidityminimized wavy and slant cuttig, 
Able to control diamond concentration to achieve cutting quality ;Excellent rigidit and cut quality
Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP, 

Electroformed dicing balde
Features: 
Wide selection of blade options; Proprietary 
thin-blade technology ;Blade thickness - 0.0
15 mm to 0.3 mm; Available for both dicing
saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 
Other specification can be produced according to customer’s requirements      


  Company: More super hard company     [ China ]        
  Contact: Anna
  Tel: 86-371-86545906
  Fax:
  Email: anna.wang@moresuperhard.com
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