Home > Offer to Sell > Organic chemicals and Derivatives > Heterocyclic compounds > Electroplating intermediates for Nickel/Cu/Zn plating
Electroplating intermediates for Nickel/Cu/Zn plating
Inquiry
| Post Date: | Mar 28,2024 |
| Expiry Date: | Mar 28,2025 |
| Detailed Description: |
Specs:ALS, ATP, BBI, PME,TCA Payment Method: T/T or Irrevocable sight L/C We produce the following Electroplating intermediates: 1).Electroplating intermediates for Ni Plating: BBI, PME, BEO, TCA, PAP, BMP, PPS-OH, ATP, ATPN, BOZ, PPS,PN, SSO3, PPS, POPDH, PS , DEP ,TC-DEP ,EHS,TC-EHS,ALS, PABS 2)).Electroplating intermediates for Zn Plating: IME,BPC,TC-BAR, MOME,BPE ,OCBA,IMIDAZOLE 3). Electroplating intermediates for Cu Plating: SPS ,MPS, EDTP, JPH, DPS, UPS, ZPS We can offer high quality products, most competitive prices, on-time delivery, as well as necessary technical service support. If you are interested in our products, please contact me by jane@brightchemical.com.cn. |
| Company: | Wuhan Bright Chemical Co., Ltd. [ China ] |
| Contact: | Jane Chow |
| Tel: | 027-85556253 |
| Fax: | 027-85804899 |
| Email: | jane@brightchemical.com.cn |
-
Disclaimer statement:The information and data included above have been realized by the enterprises and compiled by the staff, and are subject to change without notice to you. The Chemnet makes no warranties or representations whatsoever regarding the facticity, accuracy and validity of such information and data. In order to ensure your interest, we suggest you chose the products posted by our gold suppliers or VIP members.
