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Epoxy resin potting compounds WOC-87-II-D(A)/(B)

Inquiry
  Post Date: Jul 06,2019
  Expiry Date: Jul 05,2020
  Detailed Description: Description:
The product is heat conduction type epoxy adhesive, it is two-component epoxy adhesive.
Curing under room termperature, low of shrinkage rate. The heat conduction is good after curing, resistance to water is good,excellent electrical properties and have flame retardant property.

Applications:The product is used as sealant in high of heat conduction modules and PCB


  Company: Yixing Pulitai Electronic Materials Co.,Ltd.     [ China ]        
  Contact: James
  Tel: 0510-87903121
  Fax:
  Email: james91555@163.com
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