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High Temperature Applications Epoxy Resin

Inquiry
  Post Date: Mar 11,2014
  Expiry Date: Mar 11,2015
  Detailed Description: Cas No. :28768-32-3 Quantity: 1Metric Tons
Specs:Epoxy Resin for high temperature applications
Price:65 USD Kilograms
Payment Method: T/T or L/C
Mfg No.: MF-4101
Name: 4, 4'-METHYLENEBIS(N, N-DIGLYCIDYLANILINE)
CAS No: 28768-32-3
EC NO: 249-204-3
Molecular Formula: C25H30N2O4

Specification and Application

High temperature resistant,apply for 220-270 celcius degree

Known Applications

1.Carbon fiber, aramid fiber and glass fiber composite material;
2.Heat-resistant high-performance aerospace structural adhesive;
3.Plastic encapsulation material, electronic encapsulation materials, PCB laminates;
4.Anti-radiation devices.
5. TGDDM epoxy nanocomposites for aerospace and high performance applications

Package

5kg/iron drum, 20kg/iron, 200kg/iron drum or per request

Productivity

30MT/month

Storage

Room temperature away from light.

Shelf Life

1 year but can be used after retest passes for over one year.

  CAS Registry Number:

28768-32-3
  Synonyms: ;Tetraglycidyl-4,4'-methylene dianiline;4,4'-Methylenebis(diglycidyl aniline);2-Oxiranemethanamine, N,N'-(methylenedi-4,1-phenylene)bis(N-(2-oxiranylmethyl)-;4,4'-Methylenebis(N,N-bis(2,3-epoxypropyl)aniline);Oxiranemethanamine, N,N'-(methylenedi-4,1-phenylene)bis(N-(oxiranylmethyl)-;4,4'-methylenebis(N,N-bis(oxiran-2-ylmethyl)aniline);4,4'-methanediylbis[N,N-bis(oxiran-2-ylmethyl)aniline];4,4'-Methylene bis(N,N-diglycidylaniline);4,4-methylenebis(N,N-bis(oxiran-2-ylmethyl)aniline);
  Molecular Formula: C25H30N2O4
  Molecular Weight: 422.5167
  Molecular Structure: 28768-32-3 4,4'-methylenebis(N,N-diglycidylaniline)
  Hazard Symbols:  Xi:Irritant;
  Risk Codes: R43:;
  Safety Description: S36/37:;

  Company: Hubei Gemvon Chemicals Co., Ltd     [ China ]        
  Contact: Hope Deng
  Tel: +86-27-84295986
  Fax: +86-027-84295986
  Email: zzfxcl@gmail.com
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