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Polyamide resin-Hot Melt Adhesive
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| Post Date: | Jan 14,2016 |
| Expiry Date: | Jul 12,2016 |
| Detailed Description: |
Payment Method: T/T,L/C Hot melt adhesive is prepared from dimer acid polyamide resin and multiple amine through high temperature reaction.It is soluble in common organic solvents. Its viscosity when heated melting is greatly relevant to temperature . Properties: 1.Yellowish granular transparent solid. 2.Good flow performance. 3.Excellent flexility and good viscosity. 4.Strong cohesive force. Specification Type Quality index Color (Fe-Co) Viscosity (Mpa.s/25℃) Acid value (mgKOH/g) Amine value (mgKOH/g) Softening point ℃ CXD-01 ≤7# 150~250 ≤6 ≤5 1105 CXD-02 ≤7# 250~350 ≤6 ≤5 1085 Application: 1.Hot melt adhesive as seal material in electronic components, decoration in automobile. 2.Hot melt adhesive of fabric, wood, plastic, metal and ceramic. Packing: Paper bag, 25kg/bag. Storage: Store at cool and ventilate |
| Company: | Hubei Weidun Biotech Co., Ltd. [ China ] |
| Contact: | Hu Zhigao |
| Tel: | 86-728-5299099 86-728-5299099 |
| Fax: | 86-728-5299066 86-728-5299066 |
| Email: | sales@weiduntech.com |
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