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Toluenesulfonamide Formaldehyde Resin (MH/MS100)

Inquiry
  Post Date: Jul 23,2018
  Expiry Date: Jul 23,2019
  Detailed Description: Cas No. :1338-51-8 Toluenesulfonamide Formaldehyde Resin (MH/MS100)
Product Name Toluenesulfonamide Formaldehyde Resin (MH/MS100) Molecular Structure
Other Name P-Toluenesulfonamide Formaldehyde Resin; MH; MS100; O/P-Toluenesulfonamide Formaldehyde Resin
CAS No 1338-51-8
Molecular Formula (C7H10NO2S)n=2-3

Check-Point Specification
Appearance White To Pale Yellow Lucency Horniness Resin
Softening point 59-67℃
Colority (25%butyl acetate) ≤50APHA
Free Formaldehyde ≤0.2%
Moisture ≤0.5%
Acid Value ≤1.0 KOHmg/g
Packing:25kg woven bag
Product Usage:As intensifier and plasticizer used in polyamide, epoxy resin, phenol-formaldehyde resin, printing inks, coatings etc.

  CAS Registry Number:

1338-51-8

  Synonyms: ;Nail Enamel Resin BECKIMPOL-100;MH/MS;o/p-Toluenesulfonamide formuladehyde resin;Toluene sulfonamide-formaldehyde resin;
  Molecular Formula: C7H9NO2S·CH2O
  Molecular Weight: 203.261
  Molecular Structure: 1338-51-8 Benzenesulfonamide, ar-methyl-, reaction products with formaldehyde

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