Aluminium base copper-clad laminate pcb
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Post Date:
Mar 29,2013
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Expiry Date:
Sep 25,2013
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Detailed Description:
Cas No. :11
Payment Method: L/C,D/A,D/P,T/T,Western Union,MoneyGram,Get L
Detailed Product Description
1. bga pcb with 2oz copper thickness /Multilayer PCB
2.1-38 layers boards
3.ISO9001/TS16949/ROHS
4.delivery time:5-10 days
Welcome to XingDa Electric Technology Co.,Ltd
Xindaxing Electric Technology Co.,LTd
We are professional manufacturer in various PCB and PCBA with many years experience,We can provide a reasonable price with high quality products.
XingDa who can provide a full set of service.such as below:
* 1. PCB layout, PCB design
* 2: Make high difficulty PCB(1 to 38 layers)
* 3: Provide all Electronic component
* 4: PCB assembly
* 5: Write programs for clients
* 6: PCBA/finished product Test. etc.
1.PCB Specification detail.
Item Specification
1 Numbr of Layer 1-38Layers
2 Material FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
3 Finish Board Thickness 0.2mm-6.00 mm(8mil-126mil)
4 Minimun Core Thickness 0.075mm(3mil)
5 Copper Thickness 1/2 oz min;12 oz max
6 Min.Trace Width & Line Spacing 0.075mm/0.1mm(3mil/4mil)
7 Min.Hole Diameter for CNC Driling 0.1mm(4mil)
8 Min.Hole Diameter for punching 0.9mm(35mil)
9 Biggest panel size 610mm*508mm
10 Hole Positon +/-0.075mm(3mil) CNC Driling
11 Conductor Width(W) 0.05mm(2mil)or;+/-20% of original artwork
12 Hole Diameter(H) PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil)
13 Outline Tolerance 0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching
14 Warp & Twist 0.70%
15 Insulation Resistance 10Kohm-20Mohm
16 Conductivity <50ohm
17 Test Voltage 10-300V
18 Panel Size 110×100mm(min);660×600mm(max)
19 Layer-layer misregistration 4 layers:0.15mm(6mil)max;6 layers:0.25mm(10mil)max
20 Min.spacing between hole edge to circuity pqttern of an inner layer 0.25mm(10mil)
21 Min.spacing between board oulineto circuitry pattern of an inner layer 0.25mm(10mil)
22 Board thickness tolerance 4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil)
23 Impedance Control +/-10%
24 Different Impendance +-/10%
2.Details for PCB Assembly
Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
3).PCBA Test method.
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CAS Registry Number:
11
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Company:
Shenzhen Xindaxing Electric Technology Co., Ltd.
[ China ]
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Contact:
ivy zhang
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Tel:
86075529621535
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Fax:
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Email:
sales3@xdpcba.com
Inquiry