Curing agent for epoxy resins

• Post Date:

  Aug 28,2015

• Expiry Date:

  Sep 11,2015

• Detailed Description:

  Cas No. :464-58-5 Quantity: 20000Metric Tons
  Specs:DICY 10, micro-dicyandiamide
  Price:FOB 3200 USD Metric Tons
  Payment Method: TT/LC at sight
  Micro-Dicyandiamide is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clumping and improve application. Micro-dicyandiamide is designed for use as a latent agent for epoxy resins.
  The fine particle size of Micro-dicyandiamide provides enhanced reactivity in epoxy resin.
  Micro-dicyandiamide is easily dispersed in liquid resins.
  Items Index
  Appearance Free Flowing White Powder
  Purity (%) 97.5 min
  Free Water (%) 0.3 max
  Melt Point (°C) 209-212
  Particle Size (98%)［µm］ 10μm max
  Dispersant (%) 1.5 max
  Usage:
  1. Micro-dicyandiamide can be used as One Component Adhesives
  2. Micro-dicyandiamide can be used as Epoxy Powder Coatings
  3. Micro-dicyandiamide can be used as Prepregs and Film Adhesives
  4.Micro-dicyandiamide can be used as Electronic Potting and Encapsulating Compounds
  Package and Storage: Net weight 25kg, 500kg, 1000kg poly woven bag, or other package

• CAS Registry Number:

  464-58-5

• Company:

  Ningxia Beilite Chemical Industry Co., Ltd.     [ China ]        

• Contact:

  Lisa Li

• Tel:

  021-60560163

• Fax:

• Email:

  info@dicyandiamidechina.com