Electroplating intermediates for Nickel/Cu/Zn plating

• Post Date:

  Mar 28,2024

• Expiry Date:

  Mar 28,2025

• Detailed Description:

  Specs:ALS, ATP, BBI, PME,TCA
  Payment Method: T/T or Irrevocable sight L/C
  We produce the following
  Electroplating intermediates:
  1).Electroplating intermediates
  for Ni Plating: BBI, PME, BEO,
  TCA, PAP, BMP, PPS-OH, ATP, ATPN,
  BOZ, PPS,PN, SSO3, PPS, POPDH,
  PS , DEP ,TC-DEP ,EHS,TC-EHS,ALS,
  PABS
  
  2)).Electroplating intermediates
  for Zn Plating: IME,BPC,TC-BAR,
  MOME,BPE ,OCBA,IMIDAZOLE
  
  3). Electroplating intermediates
  for Cu Plating: SPS ,MPS, EDTP,
  JPH, DPS, UPS, ZPS
  
  We can offer high quality
  products, most competitive
  prices,
  on-time delivery, as well as
  necessary technical service
  support. If you are interested in
  our products, please contact me
  by
  jane@brightchemical.com.cn.

• Company:

  Wuhan Bright Chemical Co., Ltd.     [ China ]        

• Contact:

  Jane Chow

• Tel:

  027-85556253

• Fax:

  027-85804899

• Email:

  jane@brightchemical.com.cn