Epoxy resin potting compounds WOC-87-II-D(A)/(B)

• Post Date:

  Jul 06,2019

• Expiry Date:

  Jul 05,2020

• Detailed Description:

  Description:
  The product is heat conduction type epoxy adhesive, it is two-component epoxy adhesive.
  Curing under room termperature, low of shrinkage rate. The heat conduction is good after curing, resistance to water is good,excellent electrical properties and have flame retardant property.
  
  Applications:The product is used as sealant in high of heat conduction modules and PCB
  

• Company:

  Yixing Pulitai Electronic Materials Co.,Ltd.     [ China ]        

• Contact:

  James

• Tel:

  0510-87903121

• Fax:

• Email:

  james91555@163.com