PUR hot melt adhesive for mobile device assembly

• Post Date:

  Jul 04,2017

• Expiry Date:

  Jul 04,2018

• Detailed Description:

  Quantity: 10000FCL
  Price:15 USD FCL
  Payment Method: T/T, L/C
  Our mobile device assembly PUR hot melt adhesive has many advantages, such as high peel strength and great resistance to high temperature, heat and chemical corrosion. With good adhesive property, the hot melt glue can bond various plastic and metal substrates firmly, especially substrates of such digital products as mobile phones, tablet, mobile power pack, laptop, PCB etc. Economical and reliable, our products are now widely used in electronic and microelectronic industries.
  

• Company:

  Wuxi Weilichi International Trade Co., Ltd.     [ China ]        

• Contact:

  John Bao

• Tel:

  +86-510-82408850

• Fax:

  +86-510-88709343

• Email:

  johnbaocn@163.com