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spherical silica powder

Inquiry
  Post Date: Jun 04,2013
  Expiry Date: Dec 01,2013
  Detailed Description: Specs:1~15um
Payment Method: T/T

1. Application
The SSP series of spherical fused silica powder have a mono-dispersed, surface smoothness, good fluidity, low coefficient of thermal expansion characteristics which can be widely used in the EMC, electronic packaging, Electronic adhesive, Copper Clad Laminate, Underfiller, daily chemical products and so on. pengl $ sinosi, org

2. Main Specifications

SiO2 Purity: 99.95% min.

Size: D50, 0.5-10um per the user’s demands.

3. Type and Typical Data

ITEM
UNIT
SSP-10
SSP- 7
SSP- 4
SSP- 2.5
SSP- 1
Size: D50
µm
10±2
7.0±1
4.0±1
2.5±0.5
1.0±0.5
Size: Dmax
45
30
15
10
5
SiO2 content
 
%
99.95
99.95
99.95
99.95
99.95
H2O content
0.05
0.05
0.05
0.05
0.05
Percent of spheroidization
>98
>98
>98
>98
>98
Specific surface area
M2g-1
1.0
1.5
1.7
1.9
9.0
Na
 
 
 
 
 
 
ppm
<10
<10
<10
<10
<10
K
<2
<2
<2
<2
<2
Ca
<3
<3
<3
<3
<3
Mg
<1
<1
<1
<1
<1
Al
<50
<50
<50
<50
<50
Fe
<10
<10
<10
<10
<10
Ti
<10
<10
<10
<10
<10
As
<1
<1
<1
<1
<1
P
<1
<1
<1
<1
<1
Cr
<1
<1
<1
<1
<1
Mn
<1
<1
<1
<1
<1
Ni
<1
<1
<1
<1
<1
Cu
<1
<1
<1
<1
<1
Mo
<1
<1
<1
<1
<1
U
ppb
<0.3
<0.3
<0.3
<0.3
<0.3


  Company: SINOSI GROUP     [ China ]        
  Contact: Layne Peng
  Tel: +86-10-82070680
  Fax: +86-82070690
  Email: pollypenglei@hotmail.com
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