Tandof Global Limited

Copper

• Category :

• Synonyms :

  C.I. 77400;C.I. Pigment Metal 2;Copper;copper coating quality balzers;Copper ingot;raney-copper ready for use;Raney-Copper;Copperpowderdendritic;CopperrodNmmdiacElectrolytic copperagcm;CoppershotNmmdia;CopperturningsN;CopperfoilNmmthickxmmwide;Copperwireclothmeshmmwidemmwiredia;Copperwiremmdia;Copperwiresreducedfromoxide;CopperpowderNmesh;Copperpowdersphericalmesh;Copperpowdermeshunderargon;CopperwireNmmdia;CopperfoilNmmthick;CoppershotNmm;Copper powder;Copper, small rods for elemental analysis;Copper (S, P);Electrolytic tough pitch copper (O);Copper (O);Continuous cast copper (O);Electrolytic copper (trace elements);Copper with added impurities (trace elements);Copper foil(99.9%);Copper wire (99.99) 0.25mm dia.;Bronze, powder;Copper wire (99.999%) 0.76mm dia.;Copper wire cloth;Copper foil (99.9985%);Copper foil(99%);Copper shot(99.9) 1-10mm;Copper shot(99.999%) 2-8mm;Copper metal foil;Copper turnings;Copper metal wire;Copper solution 1000 ppm;Copper solution 10 000 ppm;Electrolytic copper;Sponge copper;Copper nanopowder;copper(2+);

• CAS NO :

  7440-50-8

• EC NO :

  231-159-6

• Molecular Formula :

  Cu

• Molecular Weight :

  63.5449

• Main Specifications :

• InChI :

  InChI=1/Cu/q+2

• Molecular Structure :